This machine uses the principle of heating and cooling to evenly dissolve the wax and adhere it. It is most suitable for small and thin workpieces or small batch production.
The mechanical movement of the carrier plate can avoid wafer displacement caused by personnel movement.
Mechanical pressurizing device solves the problem of wax uniformity.
The system has independent mechanisms for heating and cooling.
Thermal system heating temperature setting: 50~200℃
Cooling system cooling setting: 10~30℃
Cooling and pressure setting: 0~218 Kg, time 0~6000 seconds
The pressurizing mechanism contains a special soft buffer layer with a thickness of 5 mm.
Stable hot and cold transmission mechanism
2~ 6 inch wafer, or workpiece with maximum length ~150mm.
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