In order to improve the surface roughness of the workpiece, the polishing process needs to be used to refine the surface. After polishing, the surface of the workpiece can reach a mirror-like surface without scratches. Generally speaking, it will be used with a suitable polishing pad.

Depending on the product, it can be applied to various types of wafer workpieces, such as Sapphire, silicon, SiC, III-V, metal or non-metal, Ceramic, Glass, quartz, etc.