About us
Company

1979年

SPEEDFAM is established in Taiwan branch - Hitech Ltd. Taiwan Branch

1987年

Xinzhuzhu North rent factory, set up lapping foundry business.

Purchase land for Hsinchu Industrial Zone, prepare for the first phase of plant construction.

1988年

Completed the first phase of construction and the company was renamed Speedfam Inc.

1993年

Capital increase to NT$30,000,000

1997年

The second phase of the plant expansion was completed

The first set of automated connection 59SPAW client installation is complete

1998年

SPEEDFAM merged with IPEC, and its English name was changed to SPEEDFAM-IPEC Ltd.

2000年

SPEEDFAM-IPEC concluded its partnership with Obara Industries Co., Ltd., which is 100% owned by Obara, and renamed Topic English to Speedfam Inc.

2001年

Hsinchu third phase plant expansion completed with capital increase to NT$61,000,000

2002年

ERP / electronic signing / knowledge management system completed, a new milestone in office automation.

50SPAW 4 automatic connection equipments are produced in Taiwan, opening a new era of wafer polishing equipment in Taiwan.

2003年

SP1700 prototype development and production, extending the application of large-size LCD glass polishing

2004年

22B-5L prototype development and production completed.

2007年

The existing 24DAW equipment has increased the design mechanism of the surface groove to improve the processing efficiency of the LED chip at 24DAW.

2008年

28B-5L / Semi-automatic waxing machine developed.

2009年

30th Anniversary Celebration

develop LED sapphire industry equipment

The third-generation 24BSG-V prototype was successfully developed

2010年

32SWM, 32GPAW-TD development completed

2011年

40DPAW-TD, 36AWM, 36MS, 36GPAW-TD development completed

The 100th model of 36B series was released

2012年 

 The development of 50ALWM is completed, and the 300th model of the 36B series was released.

2014年 

 The 400th model of 9B-5L series was released

2015年 

 Double-sided machine 14.3B-5P completed

2017年

 59B fully auto-line research and development started

2018年 

32/36SWM-HT waxing machine was successfully developed

32BSG-V is introduced into the online measurement system

The 50SDE wafer thickness measuring machine has been developed

29GPAW-OSC started mass production

2019年 

The development of 59SPAW, an 8-inch silicon wafer automated production line, is completed

40th Anniversary Celebration

2020年 

6-inch wafer thinning technology attain to 15um

Completed 8-inch BGBM, 12-inch silicon wafer regeneration, 4/6-inch third-generation semiconductor total solutions