SPEEDFAM is established in Taiwan branch - Hitech Ltd. Taiwan Branch

Xinzhuzhu North rent factory, set up lapping foundry business.

Purchase land for Hsinchu Industrial Zone, prepare for the first phase of plant construction.

Completed the first phase of construction and the company was renamed Speedfam Inc.

Capital increase to NT$30,000,000

The second phase of the plant expansion was completed

The first set of automated connection 59SPAW client installation is complete

SPEEDFAM merged with IPEC, and its English name was changed to SPEEDFAM-IPEC Ltd.

SPEEDFAM-IPEC concluded its partnership with Obara Industries Co., Ltd., which is 100% owned by Obara, and renamed Topic English to Speedfam Inc.

Hsinchu third phase plant expansion completed with capital increase to NT$61,000,000

ERP / electronic signing / knowledge management system completed, a new milestone in office automation.

50SPAW 4 automatic connection equipments are produced in Taiwan, opening a new era of wafer polishing equipment in Taiwan.

SP1700 prototype development and production, extending the application of large-size LCD glass polishing

22B-5L prototype development and production completed.

The existing 24DAW equipment has increased the design mechanism of the surface groove to improve the processing efficiency of the LED chip at 24DAW.

28B-5L / Semi-automatic waxing machine developed.

30th Anniversary Celebration

develop LED sapphire industry equipment

The third-generation 24BSG-V prototype was successfully developed

32SWM, 32GPAW-TD development completed

40DPAW-TD, 36AWM, 36MS, 36GPAW-TD development completed

The 100th model of 36B series was released

 The development of 50ALWM is completed, and the 300th model of the 36B series was released.

 The 400th model of 9B-5L series was released

 Double-sided machine 14.3B-5P completed

 59B fully auto-line research and development started

32/36SWM-HT waxing machine was successfully developed

32BSG-V is introduced into the online measurement system

The 50SDE wafer thickness measuring machine has been developed

29GPAW-OSC started mass production

The development of 59SPAW, an 8-inch silicon wafer automated production line, is completed

40th Anniversary Celebration

6-inch wafer thinning technology attain to 15um

Completed 8-inch BGBM, 12-inch silicon wafer regeneration, 4/6-inch third-generation semiconductor total solutions

Completed the development of Sapphire substrate automation 2in1 robot

Completed 59SPAW fully automatic polishing line for silicon wafer production