Adopting free grinding method, 4-way independent drive: upper/lower fixed plate; center gear; ring gear.
The ECTS-III control system can accurately control the wafer thickness while processing.
Special machine for large-size wafer processing: 8/12 inches.
The slow start and slow stop devices on the disk surface can solve problems such as cracks, damage, and chipping of workpieces.
A variety of professional designs are available for purchase, which can greatly improve production capacity and processing accuracy.
We have a complete series of products suitable for precision grinding and polishing of various workpieces.
It has 50 years of professional technology from American and Japanese original factories, is produced in Taiwan, and provides complete processing technical services.
Suitable for workpieces that require simultaneous processing on both sides.
Suitable for 8 / 12 inch wafer, or irregular workpieces with similar area.
©2017 SPEEDFAM Inc. All Rights Reserved. 
Download 